Print Production A/S produces circuit boards of all types: single sided, double sided and multilayer up to 20 layers. I nothing else is agreed upon the boards will be produced according to the following standards:
PERFAG 1E, 2F, 3D – UL 796 (94V-0) – IPC-6012C, IPC-A-600H kl. II og III
Data formats
Pattern data
Extended Gerber, Standard Gerber, Gerber X2, DPF, ODB++
Drill/ rout data
Excellon, Sieb & Meyer, Gerber, Gerber X2, DPF, ODB++
Drawings
Ext. Gerber, Std. Gerber, Gerber X2,DPF, PDF, DXF, HPGL, DWG
PCB types
Materials
Multilayer
FR4
Double sided plated
FR4, Rogers
Single- and double sided
FR4, (others upon agreement)
Dimensions
Multilayer
Max 416 x 568 mm
Double sided plated
Max 432 x 582 mm
Single- and double sided
Max 432 x 582 mm
Buildup of multilayer boards
If nothing else is stated by a specification multilayer boards will be build according to Print Production standard stack-up’s
(Click on the desired layer count for more details)
4-layer   6-layer   8-layer   10-layer   12-layer
If a different stack-up is desired it must be described in the PCB specification. We are always available for advice about stack-up’s.
Track width and distances
With respect to basic copper and plating we refer to the relevant IPC and Perfag standards.
Multilayer
Double sided plated
Single- and double sided
17,5 my (approx. 35 my after plating)
0,10 mm
0,10 mm
35 my (approx. 70 my after plating)
0,10 mm
0,20 mm
70 my (approx. 105 my after plating)
0,20 mm
0,30 mm
Drilling
Smallest drilled hole = 0,2 mm (correspond with a finished hole size of 0,1 mm after plating).
Annular rings for plated boards = min. 0,15 mm.
Soldermask
Photo defineable (liquid film): Clearance min. 0,05 mm. Min. soldermask bridge between pads, 0,1 mm
Screen printed soldermask: Clearance min. 0,1 mm. Min. soldermask bridge between pads, 0,1 mm
Surface treatment
Hot Air Leveling
Lead free Hot Air Leveling
ENIG (Electroless Nickel/Immersion Gold)
Immersion Silver
Nickel/gold plating for contacts
Mechanical work
Routing (standard tool = 2,4 mm)
V-cut (scoring) (30°)
Bevelling of edge connectors
Test
Flying probe test (max. testarea = 685 x 609 mm)
PerfecTest (optimization and registration of inner layers)